| 1. | Today , a wide variety of materials and fabrication techniques enable suppliers to design stencils that meet the assembly challenges of fine - pitch technology , miniaturized components and densely packed boards 今天,多种多样的材料和制造技术时供应商能设计出的钢网能迎接细微坡度,小型化部品和高密度封装电路板的挑战。 |